Reballing ?

 All About Reballing

 Reballing means changing all the Solder Balls in the Chip Ball Grid Array Circuit, there are many different reasons why we need to reball a Chip.  We know and are quite sure with the help of this article, We will help you to know every little detail about this.

 So, let's start with:

 What Actually is Reballing?

What Actually is Reballing?

Technicians create a Ball Grid Array Circuit design to create accurate contact between the chip and the printed circuit board.  Due to many reasons such as old ball joints etc.  We need to re-make all the solder ball joints by ourselves to take the work out of that BGA Chip.  Primarily this reballing includes removing all the old solder balls and replacing them with new ones.

 Reballing mostly performs in Computer Motherboards, Laptops and Gaming Consoles and the reason behind this problem is the Video Graphic Chip.  And believe it or not, your device's Video Chip is the unluckiest chip that gets the most damaged solder joints in it and most of them need to be repaired.

 

 In fact, Not only video chips, there are many BGA Circuit Chips available in the market that need to be reballed when they are damaged or about to be damaged.

 Effects of bad solder joints:

 Sometimes when we are playing a game or some video on our computer system and suddenly the computer screen goes black and nothing comes out besides the blank screen.

 It is possible that your Gaming Console is also experiencing this kind of problem in their motherboard, just in case you are facing the same problem with your console.

 And not just a blank screen, you can also have problems like Vertical/Horizontal lines or Dots all over the screen and sometimes just because of bad solder joints the system PCB can't start the system.

Why Do BGA Chips Need Reballing?

 There are four main reasons why BGA chips need to be reballed and these 4 reasons are:

 Due to prolonged or excessive use of the Graphic Chip, the solder joints between the Chip and the PCB become loose and cause display related problems.

 Most of the BGA Chips are damaged and need to be replaced with new ones.

 Sometimes, the motherboard PCB requires upgrading/updating the BGA Chip.

 When a chip starts to get hot, it makes the solder balls get hot and they become loose and change their location, therefore sometimes creating Solder Bridges which can also shut down your PC.

Now Focus On Procedure

 First of all, performing this reballing procedure is not as easy as it seems, and there are so many different types of tools and supplies that you will need when dismantling chips.

 And you know what's the saddest part?  All the tools and supplies needed are not cheap and that is why people do not do reballing themselves.

 So, the things you need are a BGA Kit and a BGA Rework Machine which are all available on the market and you can also find them easily on the internet, and they are mandatory tools that you always need when doing a BGA Circuit Reballing.

Here's a list of necessary supplies you'll need for the Procedure:

 Soldering Iron - A Soldering Iron is a hand instrument used for soldering.  It supplies heat to melt the Solder Metal so it can flow to the damaged joints between the PCB and Electronic Components.  A soldering iron consists of a heated metal tip with an insulated handle.

 Solder Paste - Solder paste is the primary material used by printed circuit board manufacturers to connect components to the pads on a circuit board.  So, it is very helpful when we stick electronic components or solder balls on the installed area.

 Desoldering Wire - Desoldering wire, also known as soldering wick, is neatly braided 18 to 42 AWG copper wire coated with Rosin Flux, usually available on the market in rolls/coils.  The main job of this Desoldering Wire is to remove the solder from the solder joints by soaking all the metal solder in it.

 BGA Chip Case: This is just a regular holder that is only made to hold Chips for Reballing.

 BGA Chip Stencils - Chip Stencils are metal sheets with lots of holes for Solder Balls on them.  It is made of high-quality steel and can be heated directly by a hot air gun or BGA machine to make this solder ball process easy and fast.

 Solder Balls - Solder Balls are small balls of solder that are randomly scattered across the surface of the SMT board.  The primary job of these solder balls is to provide contact between chip packages and printed circuit boards, as well as between stacked packages in multichip modules.

 BGA Rework Machine - This is a heat suction machine mainly used to install or remove BGA Chips.